The North American Customer Center’s (NACC) Innovation Center (IC) is an R&D hub for new and disruptive technologies in the semiconductor vacuum space.
➤ Leads a team of 5 project engineers (3 mechanical, 1 electrical, 1 fabrication)
➤ Program manages all engineering and fabrication efforts comprised of a range of simple, short term projects and complex, long term projects (typically 2-6 projects at a time lasting between 3 days and 9 months) to fulfill the needs of both internal and external customers
➤ Project manages multidisciplinary intradepartmental projects comprised of a team of engineers, chemists, environmental analysts, and computer scientists ranging from the design and development of an electromechanical pump lift cart to the installation of hazardous gas lines in the chemistry lab to extended reality (XR) app development to aid customer site training and installation of OEM products
➤ Developed a process to track engineering and fabrication projects leading to the completion of 43 projects in 2023
➤ Enabled the technical innovation of next generation abatement head technology and bypass valve mounting
➤ Manages the Hillsboro machine shop, a collaborative space where engineers and machinists use the following equipment for prototyping: laser cutter, CNC press brake, manual mill and lathe, TIG and MIG welders
➤ Program manages the machine shop training, equipment maintenance, and governing rules
➤ Cross functional engineering project manager for large scope, high visibility R&D projects that exceed customer needs by providing prototypes of first of kind technologies for field trial evaluation at the customer's site
➤ Lead safety specialist for the IC tasked with optimizing existing and developing new processes for producing documentation including HAZOP analyses, risk assessments, product manuals, and standard operating procedures (SOP)
➤ Engineers and fabricates prototypes for field trial use by personally utilizing both traditional and additive manufacturing (AM) tools and equipment such as CNC press break, laser cutter, lathe, single axis vertical mill, and several 3D printers of varying technologies such as fused deposition modeling (FDM) and digital light processing (DLP)
➤ Facilitates the technology handoff of field trial products, engineered and fabricated by the IC, to global NPI teams, ensuring successful adoption for the purpose of transitioning products from prototype to production
Edwards, a subsidiary of Atlas Copco, engineers, manufactures and supplies vacuum and abatement equipment used in semiconductor manufacturing processes.
➤ Lead new product introduction (NPI) mechanical design engineer for the TMS gas heater product line (5 products, 20+ kits) including the design of plastic injection molded and metal 3D printed components in close partnership with suppliers
➤ Lead mechanical project engineer for the TMS silicone heater and insulation product lines (400+ product offerings, high mix/high volume) fulfilling new customer requests and closing catalog gaps through design and supplier management
➤ North American headquarters subject matter expert (SME) for Catia V6/3DX supporting
6 local users, managing their training, troubleshooting issues, and liasing with global CAD
➤ TMS SME for SAP managing engineering change requests (~ 3/week)
➤ Provides request for quote (RFQ) engineering support to sales team through engineer to order (ETO) and filling gaps in current product offering (~6/year)
➤ Provides manufacturing, production, and technical writing support in developing 20+ specifications, test plans, standard operation procedures (SOPs) and instruction manuals
➤ Identifies and fills process gaps for the engineering, planning, and purchasing interface
➤ Led the onboarding of 2 mechanical and 1 electrical engineers
Ichor engineers and manufactures gas and chemical fluid delivery subsystems for process tools used in semiconductor device manufacturing.
➤ Led a team of 3 engineering technicians in developing Operational Method Sheet (OMS) manufacturing work instructions across all product platforms resulting in 30+ discrete OMS'
➤ Led 1 technical quality writer in developing QA-specific OMS’ for 3 discrete product categories
➤ Executed new Manufacturing Execution System (MES) software roll-out, implementation, and adoption across the factory
➤ Designed stockroom floor layout for a newly acquired building as a special project for the General Manager
Lam supplies and services semiconductor manufacturing equipment for wafer fabrication processes such as thin film deposition, plasma etch, photoresist strip, and wafer cleaning along with high-precision mass metrology systems for process monitoring and control.
➤ Six month temporary contract role through Asquare Inc. as a member of the Non-Standard Request (NSR) group. The NSR group implements special customer requests for products across the Deposition Product Group platform.
➤ Executed on time completion of 8 custom deposition platform projects, 4 of which were for Samsung
Acumed designs, manufactures, and markets orthopedic medical and surgical devices.
➤ Engineered innovative medical device solutions in the orthopedic implant space (plates, screws, intramedullary rods, and instruments) in collaboration with internal and external manufacturing engineers and machinists as well as quality engineers, product managers, and orthopedic surgeons.
➤ Designed and developed 3 orthopedic bone plate families (30+ custom implants) and cutting instruments (10+) for intramedullary rod fixation for 2 high visibility new product introductions (NPI)
➤ Designed, developed, verified, validated, and supported sustaining efforts related to orthopedic implants and surgical instruments for FDA clearance (5+ initiatives)
➤ Led the customer (orthopedic surgeons) through new designs in cadaveric labs and garnered feedback to implement into the next iterative design cycle
➤ Led junior-level engineers to innovative design solutions to problems by sharing technical skills and providing guidance
Tektronix, a subsidiary of Fortive (formerly Danaher Corporation), designs and manufactures test and measurement equipment used in a wide variety of fields.
➤ Danaher Master Black Belt Candidate for Value Analysis/Value Engineering (VAVE, margin expansion through cost reduction redesign)
➤ Facilitated 5 cost reduction events that generated ideas for redesign projects worth a total annualized cost savings of ~1.5M
➤ Worked cross functionally with engineering change researchers, marketing, hardware engineers, and fellow mechanical engineers to execute 7 redesign projects over the course of 1.5 years to generate a total estimated annualized cost savings of ~60,000.
➤ Collaboratively designed and developed a new plastic injection molded handle for the Power Analyzer Product Line.
Tektronix Component Solutions Organization develops, manufactures, and tests custom, high-performance microelectronics.
➤ Lead Process Engineer for a swift sampling head program.
➤ Collaboratively developed a design for a coaxial RF MEMS switch.
➤ Designed fixtures to aid the manufacturing of microelectronics for medical radiographic equipment.
➤ Promoted from internship where I worked with microwave technology, specifically radio frequency modules, supporting the manufacturing assembly lines.