Chung-Ting Wei
Academic research: Over 6 years in Materials Science and Engineering field, such as micro-fabrication failure analysis, intermetallic reactions,... | Fremont, California, United States
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Chung-Ting Wei’s Emails ch****@am****.com
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Chung-Ting Wei’s Location Fremont, California, United States
Chung-Ting Wei’s Expertise Academic research: Over 6 years in Materials Science and Engineering field, such as micro-fabrication failure analysis, intermetallic reactions, dynamic induced reactions, laser-materials interactions, etc... Process engineer: Over 8 years in the semiconductor fabrication and R&D field. Technical skills: Microsoft Office: Word, Excel, Power Point. Simulation Code: HYADES (One Dimensional Hydrodynamic Code), Python Computational Software: Mathematica, Matlab, Origin, JMP Image Processing Software: Photoshop, ImageJ Metrology: RBS (Rutherford backscattering spectrometry), XRD (X-ray diffractometer), DTA (Differential thermal analysis), SEM (Scanning electron micro-scope), SIMS (Secondary ion mass spectrometry), TEM (Transmission electron microscope), SPHB (Split Hopkinson pressure bar test), Conventional quasi-static mechanical test, In-situ kinetic measurement of intermetallic phase formations, Micro-hardness testing. Semiconductor industrial metrology: UVision, SEMVision, Photo-mask fabricating instrument (Applied Materials Inc.), Focus ion beam machining, Semiconductor process diagnostic and correction Manufacturing methodology: PVD (Physical vapor deposition), Thermal evaporation coating, Wafer lithography process, Wet etching, Accumulative roll bonding, H/CIP (Hot/Cold isostatic pressing), Powder consolidation, Shock consolidation
Chung-Ting Wei’s Current Industry Applied Materials
Chung-Ting
Wei’s Prior Industry
Applied Materials
|
Uc San Diego
|
Tsmc
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Work Experience
Applied Materials
Application Engineer Manager
Thu Aug 01 2024 00:00:00 GMT+0000 (Coordinated Universal Time) — Present
Applied Materials
Research Development Process Engineer V
Tue May 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) — Thu Aug 01 2024 00:00:00 GMT+0000 (Coordinated Universal Time)
Tsmc
Principal Engineer (R&D)
Fri Feb 01 2013 00:00:00 GMT+0000 (Coordinated Universal Time) — Thu Feb 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time)
Applied Materials
Senior Process Engineer
Tue Nov 01 2011 00:00:00 GMT+0000 (Coordinated Universal Time) — Fri Feb 01 2013 00:00:00 GMT+0000 (Coordinated Universal Time)
Uc San Diego
Research assitant
Sat Sep 01 2007 00:00:00 GMT+0000 (Coordinated Universal Time) — Sat Oct 01 2011 00:00:00 GMT+0000 (Coordinated Universal Time)
Applied Materials
Process support engineer
Sat Apr 01 2006 00:00:00 GMT+0000 (Coordinated Universal Time) — Wed Aug 01 2007 00:00:00 GMT+0000 (Coordinated Universal Time)Skills
Languages
Chung-Ting Wei Email Addresses
FAQ About Chung-Ting Wei
-
Chung-Ting Wei is located at
Fremont, California, United States -
Chung-Ting Wei is a
Academic research: Over 6 years in Materials Science and Engineering field, such as micro-fabrication failure analysis, intermetallic reactions, dynamic induced reactions, laser-materials interactions, etc... Process engineer: Over 8 years in the semiconductor fabrication and R&D field. Technical skills: Microsoft Office: Word, Excel, Power Point. Simulation Code: HYADES (One Dimensional Hydrodynamic Code), Python Computational Software: Mathematica, Matlab, Origin, JMP Image Processing Software: Photoshop, ImageJ Metrology: RBS (Rutherford backscattering spectrometry), XRD (X-ray diffractometer), DTA (Differential thermal analysis), SEM (Scanning electron micro-scope), SIMS (Secondary ion mass spectrometry), TEM (Transmission electron microscope), SPHB (Split Hopkinson pressure bar test), Conventional quasi-static mechanical test, In-situ kinetic measurement of intermetallic phase formations, Micro-hardness testing. Semiconductor industrial metrology: UVision, SEMVision, Photo-mask fabricating instrument (Applied Materials Inc.), Focus ion beam machining, Semiconductor process diagnostic and correction Manufacturing methodology: PVD (Physical vapor deposition), Thermal evaporation coating, Wafer lithography process, Wet etching, Accumulative roll bonding, H/CIP (Hot/Cold isostatic pressing), Powder consolidation, Shock consolidation Applied Materials -
Chung-Ting Wei currently works in the
Applied Materials -
Chung-Ting Wei specializes in
Academic research: Over 6 years in Materials Science and Engineering field, such as micro-fabrication failure analysis, intermetallic reactions, dynamic induced reactions, laser-materials interactions, etc... Process engineer: Over 8 years in the semiconductor fabrication and R&D field. Technical skills: Microsoft Office: Word, Excel, Power Point. Simulation Code: HYADES (One Dimensional Hydrodynamic Code), Python Computational Software: Mathematica, Matlab, Origin, JMP Image Processing Software: Photoshop, ImageJ Metrology: RBS (Rutherford backscattering spectrometry), XRD (X-ray diffractometer), DTA (Differential thermal analysis), SEM (Scanning electron micro-scope), SIMS (Secondary ion mass spectrometry), TEM (Transmission electron microscope), SPHB (Split Hopkinson pressure bar test), Conventional quasi-static mechanical test, In-situ kinetic measurement of intermetallic phase formations, Micro-hardness testing. Semiconductor industrial metrology: UVision, SEMVision, Photo-mask fabricating instrument (Applied Materials Inc.), Focus ion beam machining, Semiconductor process diagnostic and correction Manufacturing methodology: PVD (Physical vapor deposition), Thermal evaporation coating, Wafer lithography process, Wet etching, Accumulative roll bonding, H/CIP (Hot/Cold isostatic pressing), Powder consolidation, Shock consolidation -
Chung-Ting Wei speaks the following languages:
No languages available. -
Chung-Ting Wei has prior experience in the following industries:
Applied Materials , Tsmc , Applied Materials , Uc San Diego , Applied Materials -
Chung-Ting Wei has the following professional experience:
Applied Materials , Applied Materials , Tsmc , Applied Materials , Uc San Diego , Applied Materials . -
You can view Chung-Ting Wei’s
LinkedIn profile at LinkedIn URL. -
Chung-Ting Wei’s work email addresses are
[email protected] . -
Chung-Ting Wei works at
Applied Materials
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