Juan Fernández
Portfolio: https://juanfernandez.pb.online/ Graduated from school as a Mechanical Engineer. Have been working as Quality, Packaging and Mechanical Design Engineer... | Santa Cruz, Santa Cruz, United States
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Juan Fernández’s Emails ju****@po****.com
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Juan Fernández’s Location Santa Cruz, Santa Cruz, United States
Juan Fernández’s Expertise Portfolio: https://juanfernandez.pb.online/ Graduated from school as a Mechanical Engineer. Have been working as Quality, Packaging and Mechanical Design Engineer on established companies as Product Developer on Platformin, NPD, Tactical and Cost Reduction programs. Able to work as a team leader and member, with good communication skills on both Spanish and English, and experience working with global teams from China, Netherlands, Australia, UK, Mexico and United States, travelling to some of this countries for product development, business negotiations, production and quality supervision. Responsible, accountable, working with high standards and quality. I am Certified on Solid Works Mechanical Design and I am proficient on Advance Solids, Surfaces, Sheet Metal, Assemblies and Force and Torque Simulations. Experience on CFD to do Thermal Simulations using Ansys Icepack helping to understand and improve designs based on thermal propagation problems, experience on FEA doing Torque and Force simulations to analyze and identify weak and strong sections of the design to make designs more efficient to the needs of the final usage of the product, knowledge on molding plastic flow simulation. Has developed global packaging platforms for Plantronics, managing BOMs, suppliers, materials, design, quality tests, introduction to production line and general problem solving, to mention some of the products, Plantronics Backbeat SENSE, Backbeat FIT 1, 2 & 300, Backbeat Pro 2, RIG (Gaming) Platform. Knowledge on molding plastics, sheet metals, packaging materials such as, corrugate, SBS, CCNB, PaperFoam, Paperpulp, PET Trays, Adhesives, Liners, Labels, etc.
Juan Fernández’s Current Industry Hp
Juan
Fernández’s Prior Industry
Crown Holdings
|
Plantronics
|
Sensata Technologies
|
Poly
|
Hp
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Work Experience
Hp
Senior Surfacing Designer
Tue Nov 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) — Present
Poly
Senior Surfacing Designer
Wed Jan 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time) — Tue Nov 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time)
Sensata Technologies
Mechanical Design Engineer
Fri Dec 01 2017 00:00:00 GMT+0000 (Coordinated Universal Time) — Sun Dec 01 2019 00:00:00 GMT+0000 (Coordinated Universal Time)
Plantronics
Packaging Engineer
Fri Jun 01 2012 00:00:00 GMT+0000 (Coordinated Universal Time) — Wed Nov 01 2017 00:00:00 GMT+0000 (Coordinated Universal Time)
Crown Holdings
Quality Engineer Intern
Fri Jan 01 2010 00:00:00 GMT+0000 (Coordinated Universal Time) — Thu Jul 01 2010 00:00:00 GMT+0000 (Coordinated Universal Time)Skills
Languages
Juan Fernández Email Addresses
FAQ About Juan Fernández
-
Juan Fernández is located at
Santa Cruz, Santa Cruz, United States -
Juan Fernández is a
Portfolio: https://juanfernandez.pb.online/ Graduated from school as a Mechanical Engineer. Have been working as Quality, Packaging and Mechanical Design Engineer on established companies as Product Developer on Platformin, NPD, Tactical and Cost Reduction programs. Able to work as a team leader and member, with good communication skills on both Spanish and English, and experience working with global teams from China, Netherlands, Australia, UK, Mexico and United States, travelling to some of this countries for product development, business negotiations, production and quality supervision. Responsible, accountable, working with high standards and quality. I am Certified on Solid Works Mechanical Design and I am proficient on Advance Solids, Surfaces, Sheet Metal, Assemblies and Force and Torque Simulations. Experience on CFD to do Thermal Simulations using Ansys Icepack helping to understand and improve designs based on thermal propagation problems, experience on FEA doing Torque and Force simulations to analyze and identify weak and strong sections of the design to make designs more efficient to the needs of the final usage of the product, knowledge on molding plastic flow simulation. Has developed global packaging platforms for Plantronics, managing BOMs, suppliers, materials, design, quality tests, introduction to production line and general problem solving, to mention some of the products, Plantronics Backbeat SENSE, Backbeat FIT 1, 2 & 300, Backbeat Pro 2, RIG (Gaming) Platform. Knowledge on molding plastics, sheet metals, packaging materials such as, corrugate, SBS, CCNB, PaperFoam, Paperpulp, PET Trays, Adhesives, Liners, Labels, etc. Hp -
Juan Fernández currently works in the
Hp -
Juan Fernández specializes in
Portfolio: https://juanfernandez.pb.online/ Graduated from school as a Mechanical Engineer. Have been working as Quality, Packaging and Mechanical Design Engineer on established companies as Product Developer on Platformin, NPD, Tactical and Cost Reduction programs. Able to work as a team leader and member, with good communication skills on both Spanish and English, and experience working with global teams from China, Netherlands, Australia, UK, Mexico and United States, travelling to some of this countries for product development, business negotiations, production and quality supervision. Responsible, accountable, working with high standards and quality. I am Certified on Solid Works Mechanical Design and I am proficient on Advance Solids, Surfaces, Sheet Metal, Assemblies and Force and Torque Simulations. Experience on CFD to do Thermal Simulations using Ansys Icepack helping to understand and improve designs based on thermal propagation problems, experience on FEA doing Torque and Force simulations to analyze and identify weak and strong sections of the design to make designs more efficient to the needs of the final usage of the product, knowledge on molding plastic flow simulation. Has developed global packaging platforms for Plantronics, managing BOMs, suppliers, materials, design, quality tests, introduction to production line and general problem solving, to mention some of the products, Plantronics Backbeat SENSE, Backbeat FIT 1, 2 & 300, Backbeat Pro 2, RIG (Gaming) Platform. Knowledge on molding plastics, sheet metals, packaging materials such as, corrugate, SBS, CCNB, PaperFoam, Paperpulp, PET Trays, Adhesives, Liners, Labels, etc. -
Juan Fernández speaks the following languages:
No languages available. -
Juan Fernández has prior experience in the following industries:
Poly , Sensata Technologies , Plantronics , Crown Holdings -
Juan Fernández has the following professional experience:
Hp , Poly , Sensata Technologies , Plantronics , Crown Holdings . -
You can view Juan Fernández’s
LinkedIn profile at LinkedIn URL. -
Juan Fernández’s work email addresses are
[email protected] . -
Juan Fernández works at
Hp
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