Keng Yuen

FAQ About Keng Yuen

• What is Keng Yuen's address?

  Keng Yuen is located at
  Singapore

• What is Keng Yuen's job title?

  Keng Yuen is a
  2005 - Present : UTAC Pte Ltd - as Corporate Advance Packaging R&D Principal Engineer - Corporate Team Lead managing, driving, developing and defining UTAC overall TCB-NCP and TSS packaging technology and technology proliferation across different sites. - R&D pioneer team in UTAC to develop and qualify C2/C4 FCCSP / FCBGA packages into mass production (Process and machine development/benchmark/setup/buyoff). - Flip Chip & TCB-NCP Bonder/Reflow/Plasma/Underfill/Flux Cleaner machine benchmarking, buyoff and qualification - 3D Consortium Member of IMEC Europe and IME Singapore My Reference : Surasit Chung., PhD, Senior VP of BE Technology, NXP Semiconductors, Phone number : +65 9621 4953, Email : [email protected] 2003 - 2005 : Infineon Technologies Asia Pacific Pte Ltd - as Senior Manufacturing Engineer. - Part of the pioneer setup team for the first ever flip chip on laminate production line in Singapore with Infineon. Involve in machine selection and benchmarking, FMEA/Control Plan/Process Specification/Maintenance Specification, product qualification, yield improvement, technology proliferation and assembly integration and full automation. 1999 - 2002 : Carsem Semiconductor Sdn Bhd (MPI)- as Senior Engineer -Developing and patented FCOL (Flip chip on leadframe - SOT & QFN), Flip Chip Hybrid Module and low pin count FCCSP development, qualification and transfer to mass production Goals: - Team Lead for advance process development - A self-starter, determined, committed, self-motivated, resourceful, with great perseverance, initiative and drive. - Good interpersonal skills, great team player and also great independent contributor. Ability to work under no supervision. - Full Hand-on with process/equipment. Development / evaluation / qualification. Specialties: - Project Management and Process Hands on/Execution - Very experience with new product development, full production qualification then to mass production. - Expert in TSS for fine pitch TSV/TSI packages, with C2/C4 or TCB-NCP process - Expert in TCB-NCP process for fine pitch FCBGA/FCPoP and C2C/C2W. - Expert in Flip Chip processes (FCCSP/FCBGA). - Expert in Flip chip bonder/flux cleaner/underfiller/TCB-NCP bonding machines benchmarking and qualification. - DOE conceptualization and execution Institute Of Microelectronics

• What industry does Keng Yuen currently work in?

  Keng Yuen currently works in the
  Institute Of Microelectronics

• What is Keng Yuen's area of expertise?

  Keng Yuen specializes in
  2005 - Present : UTAC Pte Ltd - as Corporate Advance Packaging R&D Principal Engineer - Corporate Team Lead managing, driving, developing and defining UTAC overall TCB-NCP and TSS packaging technology and technology proliferation across different sites. - R&D pioneer team in UTAC to develop and qualify C2/C4 FCCSP / FCBGA packages into mass production (Process and machine development/benchmark/setup/buyoff). - Flip Chip & TCB-NCP Bonder/Reflow/Plasma/Underfill/Flux Cleaner machine benchmarking, buyoff and qualification - 3D Consortium Member of IMEC Europe and IME Singapore My Reference : Surasit Chung., PhD, Senior VP of BE Technology, NXP Semiconductors, Phone number : +65 9621 4953, Email : [email protected] 2003 - 2005 : Infineon Technologies Asia Pacific Pte Ltd - as Senior Manufacturing Engineer. - Part of the pioneer setup team for the first ever flip chip on laminate production line in Singapore with Infineon. Involve in machine selection and benchmarking, FMEA/Control Plan/Process Specification/Maintenance Specification, product qualification, yield improvement, technology proliferation and assembly integration and full automation. 1999 - 2002 : Carsem Semiconductor Sdn Bhd (MPI)- as Senior Engineer -Developing and patented FCOL (Flip chip on leadframe - SOT & QFN), Flip Chip Hybrid Module and low pin count FCCSP development, qualification and transfer to mass production Goals: - Team Lead for advance process development - A self-starter, determined, committed, self-motivated, resourceful, with great perseverance, initiative and drive. - Good interpersonal skills, great team player and also great independent contributor. Ability to work under no supervision. - Full Hand-on with process/equipment. Development / evaluation / qualification. Specialties: - Project Management and Process Hands on/Execution - Very experience with new product development, full production qualification then to mass production. - Expert in TSS for fine pitch TSV/TSI packages, with C2/C4 or TCB-NCP process - Expert in TCB-NCP process for fine pitch FCBGA/FCPoP and C2C/C2W. - Expert in Flip Chip processes (FCCSP/FCBGA). - Expert in Flip chip bonder/flux cleaner/underfiller/TCB-NCP bonding machines benchmarking and qualification. - DOE conceptualization and execution

• Which languages does Keng Yuen speak? 

  Keng Yuen speaks the following languages:
  No languages available.

• Which industries has Keng Yuen previously worked in?   

  Keng Yuen has prior experience in the following industries:
  Apple , Institute Of Microelectronics , Utac , Infineon Technologies , Carsem

• What is Keng Yuen’s work experience?  

  Keng Yuen has the following professional experience:
  Institute Of Microelectronics , Apple , Institute Of Microelectronics , Utac , Infineon Technologies , Carsem .

• How can I find Keng Yuen on LinkedIn?  

  You can view Keng Yuen’s
  LinkedIn profile at LinkedIn URL.

• What are Keng Yuen’s work email addresses?  

  Keng Yuen’s work email addresses are
  [email protected] .

• What company does Keng Yuen work for?  

  Keng Yuen works at
  Institute Of Microelectronics