Rahul Agarwal

FAQ About Rahul Agarwal

• What is Rahul Agarwal's address?

  Rahul Agarwal is located at
  555 East Washington AvenueApartment 1006, Sunnyvale, United States

• What is Rahul Agarwal's job title?

  Rahul Agarwal is a
  ● Packaging architect with proven track record of bringing complex packaging platforms from concept phase to High Volume Manufacturing. ● Lead the team who developed industries 1st hybrid bonded 3D stacked devices in HPC (3D V-Cache). ● Evangelized and developed Elevated Fanout Bridge (EFB) technology with multiple OSATs. ● Proven track record in working with various stake holders (both internal and external) to bring novel packaging platforms to the market. ● Proficient in microelectronics packaging with Through Silicon Via (TSV), Hybrid bonding, 3D V-Cache, flip-chip and wire bonding technologies. Expertise in various packaging techniques (anodic, fusion, eutectic, thermo-compression, epoxy, solder, TLP, hybrid bonding), wire bonding, flip chip bonding, soldering, bumping, underfilling, 3D WLP, UTCS, 3D SiC ● Superior knowledge in wafer thinning and handling technology with temporary bonding/thinning/debonding and 3D die to die and die to wafer stacking technology ● Experienced in defining stacking/packaging flows for wide range of projects (3D IC, 3D WLP, chip embedding, MEMS) ● Emphasize on Zero-Level / Wafer-Level packaging based on polymer / metal bonding ● Expertise in process stabilization and improvement through feedback from customers. Risk assessment, specifications and planning definition in close interaction with client ● Technical analysis and benchmarking ● Experienced process integration engineer working on various platforms ● Excellent project management skill and experienced in leading project/teams Specialties: 3D packaging, Stacking, TSV, Hybrid bonding, 3D V-Cache, microbumping, MEMS, Process development and integration, Microsoft

• What industry does Rahul Agarwal currently work in?

  Rahul Agarwal currently works in the
  Microsoft

• What is Rahul Agarwal's area of expertise?

  Rahul Agarwal specializes in
  ● Packaging architect with proven track record of bringing complex packaging platforms from concept phase to High Volume Manufacturing. ● Lead the team who developed industries 1st hybrid bonded 3D stacked devices in HPC (3D V-Cache). ● Evangelized and developed Elevated Fanout Bridge (EFB) technology with multiple OSATs. ● Proven track record in working with various stake holders (both internal and external) to bring novel packaging platforms to the market. ● Proficient in microelectronics packaging with Through Silicon Via (TSV), Hybrid bonding, 3D V-Cache, flip-chip and wire bonding technologies. Expertise in various packaging techniques (anodic, fusion, eutectic, thermo-compression, epoxy, solder, TLP, hybrid bonding), wire bonding, flip chip bonding, soldering, bumping, underfilling, 3D WLP, UTCS, 3D SiC ● Superior knowledge in wafer thinning and handling technology with temporary bonding/thinning/debonding and 3D die to die and die to wafer stacking technology ● Experienced in defining stacking/packaging flows for wide range of projects (3D IC, 3D WLP, chip embedding, MEMS) ● Emphasize on Zero-Level / Wafer-Level packaging based on polymer / metal bonding ● Expertise in process stabilization and improvement through feedback from customers. Risk assessment, specifications and planning definition in close interaction with client ● Technical analysis and benchmarking ● Experienced process integration engineer working on various platforms ● Excellent project management skill and experienced in leading project/teams Specialties: 3D packaging, Stacking, TSV, Hybrid bonding, 3D V-Cache, microbumping, MEMS, Process development and integration,

• Which languages does Rahul Agarwal speak? 

  Rahul Agarwal speaks the following languages:
  No languages available.

• Which industries has Rahul Agarwal previously worked in?   

  Rahul Agarwal has prior experience in the following industries:
  Amd , Amd , Globalfoundries , Globalfoundries , Institute Of Microelectronics , Institute Of Microelectronics , Imec , University Of South Florida

• What is Rahul Agarwal’s work experience?  

  Rahul Agarwal has the following professional experience:
  Microsoft , Amd , Amd , Globalfoundries , Globalfoundries , Institute Of Microelectronics , Institute Of Microelectronics , Imec , University Of South Florida .

• How can I find Rahul Agarwal on LinkedIn?  

  You can view Rahul Agarwal’s
  LinkedIn profile at LinkedIn URL.

• What are Rahul Agarwal’s work email addresses?  

  Rahul Agarwal’s work email addresses are
  [email protected] .

• What company does Rahul Agarwal work for?  

  Rahul Agarwal works at
  Microsoft