
Shailesh Konda
7 years of semiconductor processing experience working on latest 3D packaging technologies and delivering port-folio of products from... | Beaverton, Oregon, United States
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Shailesh Konda’s Location Beaverton, Oregon, United States
Shailesh Konda’s Expertise 7 years of semiconductor processing experience working on latest 3D packaging technologies and delivering port-folio of products from pathfinding/research to High Volume Manufacturing phase. Defined roadmaps to meet requirements, goals and milestones for dry etch and ash cleans process Designed and developed equipment for the process to meet quality, reliability, cost, yield, productivity, and manufacturability requirements Established process control systems for the process module and sustained the module through volume ramp Transferred process to high volume manufacturing and provided support in new factory setup as well as install and qualification of the new production lines
Shailesh Konda’s Current Industry Intel
Shailesh
Konda’s Prior Industry
University At Buffalo
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Intel
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Work Experience

Intel
Packaging Engineer
Fri Dec 01 2017 00:00:00 GMT+0000 (Coordinated Universal Time) — Present
University At Buffalo
Research Assistant
Wed Aug 01 2012 00:00:00 GMT+0000 (Coordinated Universal Time) — Fri Sep 01 2017 00:00:00 GMT+0000 (Coordinated Universal Time)