Yogeswaran Gnanasegaran

FAQ About Yogeswaran Gnanasegaran

• What is Yogeswaran Gnanasegaran's address?

  Yogeswaran Gnanasegaran is located at
  Singapore, Singapore, Singapore

• What is Yogeswaran Gnanasegaran's job title?

  Yogeswaran Gnanasegaran is a
  Motivated and skillful process engineer with 6 years of working experience in semiconductor industry. Engaged with Front of Line Backend Semiconductor Assembly package which is process development activities and innovation project. Broad range of experience throughout my career such as process engineering for FOL in Die Bond, Clip Bond, Reflow Oven and etc. Technical background: Solder dispensing, stencil printing; Hot die attach i.e eutectic (discrete packages), soft solder & diffusion solder (Power packages); cold die attach i.e epoxy and solder paste (Power IC packages); conduction, convection & vacuum reflow oven process. Soft skills: I am able to solve complex technical problems using logical and analytical thought process based on the facts and data. i.e solder void reduction by implementation of new technology reflow oven with the combination with process optimization, influencing factors and impacts to the current process. Infineon Technologies

• What industry does Yogeswaran Gnanasegaran currently work in?

  Yogeswaran Gnanasegaran currently works in the
  Infineon Technologies

• What is Yogeswaran Gnanasegaran's area of expertise?

  Yogeswaran Gnanasegaran specializes in
  Motivated and skillful process engineer with 6 years of working experience in semiconductor industry. Engaged with Front of Line Backend Semiconductor Assembly package which is process development activities and innovation project. Broad range of experience throughout my career such as process engineering for FOL in Die Bond, Clip Bond, Reflow Oven and etc. Technical background: Solder dispensing, stencil printing; Hot die attach i.e eutectic (discrete packages), soft solder & diffusion solder (Power packages); cold die attach i.e epoxy and solder paste (Power IC packages); conduction, convection & vacuum reflow oven process. Soft skills: I am able to solve complex technical problems using logical and analytical thought process based on the facts and data. i.e solder void reduction by implementation of new technology reflow oven with the combination with process optimization, influencing factors and impacts to the current process.

• Which languages does Yogeswaran Gnanasegaran speak? 

  Yogeswaran Gnanasegaran speaks the following languages:
  No languages available.

• Which industries has Yogeswaran Gnanasegaran previously worked in?   

  Yogeswaran Gnanasegaran has prior experience in the following industries:
  Globalfoundries , Infineon Technologies , Infineon Technologies

• What is Yogeswaran Gnanasegaran’s work experience?  

  Yogeswaran Gnanasegaran has the following professional experience:
  Infineon Technologies , Globalfoundries , Infineon Technologies , Infineon Technologies .

• How can I find Yogeswaran Gnanasegaran on LinkedIn?  

  You can view Yogeswaran Gnanasegaran’s
  LinkedIn profile at LinkedIn URL.

• What are Yogeswaran Gnanasegaran’s work email addresses?  

  Yogeswaran Gnanasegaran’s work email addresses are
  [email protected] .

• What company does Yogeswaran Gnanasegaran work for?  

  Yogeswaran Gnanasegaran works at
  Infineon Technologies